JEONGKYU HA

Person

HWASEONG-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package with trench to reduce slippage and display dev...
- Patent number 12,148,337
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip-on-film package, display module including same, and electronic...
- Patent number 12,085,990
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Jeongkyu Ha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip-on-film package, display module including same, and electronic...
- Patent number 11,836,006
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Jeongkyu Ha
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A FILM SUBSTRATE
- Publication number 20250062178
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kyoungsuk YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE
- Publication number 20250022998
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321902
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Narae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME
- Publication number 20240204009
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20240162213
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Yechung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20240096909
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240088003
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Narae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE, DISPLAY MODULE INCLUDING SAME, AND ELECTRONIC...
- Publication number 20230333599
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Jeongkyu Ha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230036519
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Sanguk HAN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20220246530
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE, DISPLAY MODULE INCLUDING SAME, AND ELECTRONIC...
- Publication number 20210255669
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- JEONGKYU HA
- G06 - COMPUTING CALCULATING COUNTING

JEONGKYU HA

Person

Patents Grantslast 30 patents

Chip-on-film package and display apparatus including the same

Chip on film package with trench to reduce slippage and display dev...

Chip-on-film package, display module including same, and electronic...

Chip-on-film package, display module including same, and electronic...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A FILM SUBSTRATE

FILM PACKAGE

CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF

FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

CHIP-ON-FILM PACKAGE, DISPLAY MODULE INCLUDING SAME, AND ELECTRONIC...

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

CHIP-ON-FILM PACKAGE, DISPLAY MODULE INCLUDING SAME, AND ELECTRONIC...