Jeonil Lee

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal pad, semiconductor chip including the same and method of ma...
- Patent number 12,159,859
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including buried contact and method for manufa...
- Patent number 11,844,207
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Jeonil Lee
Information Patent Grant
Method of directly growing carbon material on substrate
- Patent number 11,149,346
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Changhyun Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240324237
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERGRATED CIRCUIT DEVICES
- Publication number 20240322048
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyunghwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) FERROELECTRIC RANDOM ACCESS MEMORY (FERAM) A...
- Publication number 20240324234
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonil Lee
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240276713
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Jeonil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240099015
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonil LEE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BURIED CONTACT AND METHOD FOR MANUFA...
- Publication number 20240098974
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonil LEE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230389290
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE LAYER
- Publication number 20230369214
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Jeonil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices
- Publication number 20230232612
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Chanwoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SPACER STRUCTURES
- Publication number 20230178634
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230138616
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20230116911
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230077803
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...
- Publication number 20230078980
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE
- Publication number 20230067386
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- MINJUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BURIED CONTACT AND METHOD FOR MANUFA...
- Publication number 20230051597
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE AND METHOD FOR MANUFAC...
- Publication number 20230005818
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRE-TREATING SUBSTRATE AND METHOD OF DIRECTLY FORMING GRA...
- Publication number 20200286732
- Publication date Sep 10, 2020
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DIRECTLY GROWING CARBON MATERIAL ON SUBSTRATE
- Publication number 20200032388
- Publication date Jan 30, 2020
- Samsung Electronics Co., Ltd.
- Changhyun Kim
- C01 - INORGANIC CHEMISTRY

Person

Patents Grantslast 30 patents

Thermal pad, semiconductor chip including the same and method of ma...

Semiconductor device including buried contact and method for manufa...

Method of directly growing carbon material on substrate

Patents Applicationslast 30 patents

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE

INTERGRATED CIRCUIT DEVICES

THREE-DIMENSIONAL (3D) FERROELECTRIC RANDOM ACCESS MEMORY (FERAM) A...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING BURIED CONTACT AND METHOD FOR MANUFA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE LAYER

Semiconductor Devices

SEMICONDUCTOR DEVICES HAVING SPACER STRUCTURES

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

SEMICONDUCTOR DEVICES

THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...

SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING BURIED CONTACT AND METHOD FOR MANUFA...

SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE AND METHOD FOR MANUFAC...

METHOD OF PRE-TREATING SUBSTRATE AND METHOD OF DIRECTLY FORMING GRA...

METHOD OF DIRECTLY GROWING CARBON MATERIAL ON SUBSTRATE