Jeremy BROWN

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New Albany, IN, US

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Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio vias filled with liquid metal fill
- Patent number 12,336,112
- Issue date Jun 17, 2025
- Samtec, Inc.
- Christopher David Bohn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL
- Publication number 20240196540
- Publication date Jun 13, 2024
- SAMTEC, INC.
- Christopher David BOHN
- H01 - BASIC ELECTRIC ELEMENTS