Jeremy E. Minnich

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for solder bridging elimination for bulk solder C2S intercon...
- Patent number 11,670,612
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 11,594,432
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,998,208
- Issue date May 4, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for substrate moisture NCF voiding elimination
- Patent number 10,879,195
- Issue date Dec 29, 2020
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for inhibiting bonding materials from contamina...
- Patent number 10,700,038
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,410,891
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for 3D ink jet TCB interconnect control
- Patent number 10,276,539
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,090,177
- Issue date Oct 2, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mount tape die release system for thin die ejection
- Patent number 10,043,688
- Issue date Aug 7, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package having an adhesive flow restriction area
- Patent number 7,491,570
- Issue date Feb 17, 2009
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package having an adhesive flow restriction area
- Patent number 7,476,955
- Issue date Jan 13, 2009
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20210225672
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
- Publication number 20210183802
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Substrate Moisture NCF Voiding Elimination
- Publication number 20210111132
- Publication date Apr 15, 2021
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20190326142
- Publication date Oct 24, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Substrate Moisture NCF Voiding Elimination
- Publication number 20190252330
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for 3D Ink Jet TCB Interconnect Control
- Publication number 20190131272
- Publication date May 2, 2019
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR INHIBITING BONDING MATERIALS FROM CONTAMINA...
- Publication number 20190067238
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
- Publication number 20190067232
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20190067053
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Die package having an adhesive flow restriction area
- Publication number 20070114646
- Publication date May 24, 2007
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die package having an adhesive flow restriction area
- Publication number 20050156266
- Publication date Jul 21, 2005
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die package having an adhesive flow restriction area
- Publication number 20050151272
- Publication date Jul 14, 2005
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS

Jeremy E. Minnich

Person

Patents Grantslast 30 patents

Method for solder bridging elimination for bulk solder C2S intercon...

Cold fluid semiconductor device release during pick and place opera...

Cold fluid semiconductor device release during pick and place opera...

Method for substrate moisture NCF voiding elimination

Methods and systems for inhibiting bonding materials from contamina...

Cold fluid semiconductor device release during pick and place opera...

Method for 3D ink jet TCB interconnect control

Cold fluid semiconductor device release during pick and place opera...

Method for mount tape die release system for thin die ejection

Die package having an adhesive flow restriction area

Die package having an adhesive flow restriction area

Patents Applicationslast 30 patents

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...

Method for Substrate Moisture NCF Voiding Elimination

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

Method for Substrate Moisture NCF Voiding Elimination

Method for 3D Ink Jet TCB Interconnect Control

METHODS AND SYSTEMS FOR INHIBITING BONDING MATERIALS FROM CONTAMINA...

Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

Die package having an adhesive flow restriction area

Die package having an adhesive flow restriction area

Die package having an adhesive flow restriction area