Jeremy J. Schmitz

Follow

Person

Minnetrista, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for packaging thermal interface materials
- Patent number 8,430,264
- Issue date Apr 30, 2013
- The Bergquist Company
- Radesh Jewram
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
Thermally Conductive Dielectric Interface
- Publication number 20140374071
- Publication date Dec 25, 2014
- John Timmerman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Packaging Thermal Interface Materials
- Publication number 20130221014
- Publication date Aug 29, 2013
- The Bergquist Company
- Radesh Jewram
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Method for Packaging Thermal Interface Materials
- Publication number 20110186586
- Publication date Aug 4, 2011
- Radesh Jewram
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL