Jeroen A. Bielen

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Molenhoek, NL

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Patents Grantslast 30 patents

Information Patent Grant
High-power die heat sink
- Patent number 11,948,853
- Issue date Apr 2, 2024
- QUALCOMM Technologies Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device and method for tuning an RF device
- Patent number 9,300,270
- Issue date Mar 29, 2016
- QUALCOMM Technologies, Inc.
- Zidong Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier assembly
- Patent number 8,067,840
- Issue date Nov 29, 2011
- NXP B.V.
- Jeroen A. Bielen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LEVEL STACKED ACOUSTIC WAVE (AW) FILTER PACKAGES AND RELATED...
- Publication number 20230090842
- Publication date Mar 23, 2023
- RF360 EUROPE GMBH
- Manuel Hofer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DIE MODULE PACKAGES WITH VOID-DEFINED SECTIONS IN A M...
- Publication number 20230076844
- Publication date Mar 9, 2023
- QUALCOMM Incorporated
- Andreas Detlefsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER DIE HEAT SINK
- Publication number 20220359337
- Publication date Nov 10, 2022
- QUALCOMM TECHNOLOGIES, INC.
- Jose MOREIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF Device and Method for Tuning an RF Device
- Publication number 20130335168
- Publication date Dec 19, 2013
- EPCOS AG
- Zidong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Amplifier Assembly
- Publication number 20100059879
- Publication date Mar 11, 2010
- NXP B.V.
- Jeroen A. Bielen
- H01 - BASIC ELECTRIC ELEMENTS