Jeroen Haneveld

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Lochem, NL

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming an electrically conductive via in a substrate
- Patent number 9,748,136
- Issue date Aug 29, 2017
- Micronit Microfluidics B.V.
- Ronny Van 'T Oever
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding two substrates and device manufactured thereby
- Patent number 9,573,804
- Issue date Feb 21, 2017
- Micronit Microfluidics B.V.
- Ronny Van 'T Oever
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Method of Bonding Two Substrates and Device Manufactured Thereby
- Publication number 20170183223
- Publication date Jun 29, 2017
- MICRONIT MICROFLUIDICS B.V.
- Ronny VAN 'T OEVER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING AN ELECTRICALLY CONDUCTIVE VIA IN A SUBSTRATE
- Publication number 20150262874
- Publication date Sep 17, 2015
- MICRONIT MICROFLUIDICS B.V.
- Ronny Van'T Oever
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Bonding Two Substrates and Device Manufactured Thereby
- Publication number 20140335301
- Publication date Nov 13, 2014
- Ronny Van 'T Oever
- B81 - MICRO-STRUCTURAL TECHNOLOGY