Jerome TEYSSEYRE

Person

Ang Mo Kio, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Molded proximity sensor
- Patent number 11,988,743
- Issue date May 21, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Molded proximity sensor
- Patent number 11,513,220
- Issue date Nov 29, 2022
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interposer on a leaderframe
- Patent number 11,296,069
- Issue date Apr 5, 2022
- Semiconductor Components Industries, LLC
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact microelectronic integrated gas sensor
- Patent number 11,231,386
- Issue date Jan 25, 2022
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING
Information Patent Grant
Substrate interposer on a leadframe
- Patent number 10,546,847
- Issue date Jan 28, 2020
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded proximity sensor
- Patent number 10,429,509
- Issue date Oct 1, 2019
- STMicroelectronics Pte Ltd
- Jing-En Luan
- G01 - MEASURING TESTING
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 10,256,178
- Issue date Apr 9, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pillar and bump structures
- Patent number 10,128,207
- Issue date Nov 13, 2018
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact microelectronic integrated gas sensor
- Patent number 9,851,328
- Issue date Dec 26, 2017
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING
Information Patent Grant
Top gate mold with particle trap
- Patent number 9,254,596
- Issue date Feb 9, 2016
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Image sensor device with IR filter and related methods
- Patent number 9,059,058
- Issue date Jun 16, 2015
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for a microelectromechanical system device with electromagnetic...
- Patent number 8,987,871
- Issue date Mar 24, 2015
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating land grid array semiconductor package
- Patent number 8,860,207
- Issue date Oct 14, 2014
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating land grid array semiconductor package
- Patent number 8,664,044
- Issue date Mar 4, 2014
- STMicroelectronics Pte Ltd
- Yonggang Jin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...
- Publication number 20240413148
- Publication date Dec 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tiburcio A. MALDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT
- Publication number 20240222231
- Publication date Jul 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CLIP WITH ALIGNER STRUCTURE
- Publication number 20240194631
- Publication date Jun 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING MIRRORED LEADS
- Publication number 20240128140
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED M...
- Publication number 20240128197
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Olaf ZSCHIESCHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20240120328
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20240071860
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20240030108
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PROXIMITY SENSOR
- Publication number 20230071048
- Publication date Mar 9, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTERPOSER ON A LEADFRAME
- Publication number 20200219866
- Publication date Jul 9, 2020
- Fairchild Semiconductor Corporation
- Elsie Agdon CABAHUG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PROXIMITY SENSOR
- Publication number 20190391264
- Publication date Dec 26, 2019
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT MICROELECTRONIC INTEGRATED GAS SENSOR
- Publication number 20180067074
- Publication date Mar 8, 2018
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20180068935
- Publication date Mar 8, 2018
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PILLAR AND BUMP STRUCTURES
- Publication number 20160293559
- Publication date Oct 6, 2016
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTERPOSER ON A LEADFRAME
- Publication number 20160284631
- Publication date Sep 29, 2016
- Fairchild Semiconductor Corporation
- Elsie Agdon CABAHUG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PROXIMITY SENSOR
- Publication number 20160187483
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- G01 - MEASURING TESTING
Information Patent Application
COMPACT MICROELECTRONIC INTEGRATED GAS SENSOR
- Publication number 20160047774
- Publication date Feb 18, 2016
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FABRICATING LAND GRID ARRAY SEMICONDUCTOR PACKAGE
- Publication number 20140191387
- Publication date Jul 10, 2014
- STMicroelectronics Grenoble 2 SAS
- Yonggang JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE WITH IR FILTER AND RELATED METHODS
- Publication number 20140110565
- Publication date Apr 24, 2014
- STMicroelectronics Asia Pacific PTE LTD (Singapore)
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP FOR A MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTROMAGNETIC...
- Publication number 20130322039
- Publication date Dec 5, 2013
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOP GATE MOLD WITH PARTICLE TRAP
- Publication number 20130168899
- Publication date Jul 4, 2013
- STMicroelectronics Pte Ltd
- Jerome Teysseyre
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LAND GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20130105982
- Publication date May 2, 2013
- STMICROELECTRONICS GRENOBLE2 SAS
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS

Jerome TEYSSEYRE

Person

Patents Grantslast 30 patents

Molded proximity sensor

Molded proximity sensor

Substrate interposer on a leaderframe

Compact microelectronic integrated gas sensor

Substrate interposer on a leadframe

Molded proximity sensor

Vertical and horizontal circuit assemblies

Semiconductor packages with pillar and bump structures

Compact microelectronic integrated gas sensor

Top gate mold with particle trap

Image sensor device with IR filter and related methods

Cap for a microelectromechanical system device with electromagnetic...

Method of fabricating land grid array semiconductor package

Method of fabricating land grid array semiconductor package

Patents Applicationslast 30 patents

ISOLATED 3D SEMICONDUCTOR DEVICE PACKAGE WITH TRANSISTORS ATTACHED...

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT

FLEXIBLE CLIP WITH ALIGNER STRUCTURE

POWER MODULE PACKAGE HAVING MIRRORED LEADS

ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED M...

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

HIGH POWER MODULE PACKAGE STRUCTURES

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

MOLDED PROXIMITY SENSOR

SUBSTRATE INTERPOSER ON A LEADFRAME

MOLDED PROXIMITY SENSOR

COMPACT MICROELECTRONIC INTEGRATED GAS SENSOR

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

SEMICONDUCTOR PACKAGES WITH PILLAR AND BUMP STRUCTURES

SUBSTRATE INTERPOSER ON A LEADFRAME

MOLDED PROXIMITY SENSOR

COMPACT MICROELECTRONIC INTEGRATED GAS SENSOR

METHOD OF FABRICATING LAND GRID ARRAY SEMICONDUCTOR PACKAGE

IMAGE SENSOR DEVICE WITH IR FILTER AND RELATED METHODS

CAP FOR A MICROELECTROMECHANICAL SYSTEM DEVICE WITH ELECTROMAGNETIC...

TOP GATE MOLD WITH PARTICLE TRAP

LAND GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE