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FLEXIBLE CLIP
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Publication number 20230326902
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Publication date Oct 12, 2023
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Semiconductor Components Industries, LLC
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Keunhyuk LEE
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H01 - BASIC ELECTRIC ELEMENTS
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HEAT TRANSFER FOR POWER MODULES
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Publication number 20230230895
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Publication date Jul 20, 2023
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Jerome TEYSSEYRE
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H01 - BASIC ELECTRIC ELEMENTS
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SUBMODULE SEMICONDUCTOR PACKAGE
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Publication number 20220406744
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Publication date Dec 22, 2022
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Semiconductor Components Industries, LLC
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JooYang EOM
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH POWER MODULE PACKAGE STRUCTURES
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Publication number 20210351101
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Publication date Nov 11, 2021
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Semiconductor Components Industries, LLC
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Yusheng LIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE ASSEMBLIES
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Publication number 20200411421
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Publication date Dec 31, 2020
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Semiconductor Components Industries, LLC
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Jerome TEYSSEYRE
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H01 - BASIC ELECTRIC ELEMENTS
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HEAT TRANSFER FOR POWER MODULES
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Publication number 20200388557
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Publication date Dec 10, 2020
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Semiconductor Components Industries, LLC
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Inpil YOO
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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HEAT TRANSFER FOR POWER MODULES
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Publication number 20200335414
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Publication date Oct 22, 2020
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Semiconductor Components Industries, LLC
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Jerome TEYSSEYRE
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE WITH HEATSINK
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Publication number 20200273782
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Publication date Aug 27, 2020
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Semiconductor Components Industries, LLC
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Maria Clemens Ypil QUINONES
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H01 - BASIC ELECTRIC ELEMENTS
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POWER SEMICONDUCTOR DEVICE PACKAGE
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Publication number 20200258824
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Publication date Aug 13, 2020
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Semiconductor Components Industries, LLC
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Tiburcio MALDO
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H01 - BASIC ELECTRIC ELEMENTS
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HEAT TRANSFER FOR POWER MODULES
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Publication number 20190341327
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Publication date Nov 7, 2019
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Semiconductor Components Industries, LLC
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Jerome TEYSSEYRE
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H01 - BASIC ELECTRIC ELEMENTS
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