Jerrod Peterson

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heatsink with a sandwich plate construction
- Patent number 11,963,335
- Issue date Apr 16, 2024
- Intel Corporation
- Juha Tapani Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal thermal interface material application
- Patent number 11,679,407
- Issue date Jun 20, 2023
- Intel Corporation
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods and apparatus to provide electrical shielding for integrate...
- Patent number 11,616,000
- Issue date Mar 28, 2023
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced systems and methods for improved heat transfer from semico...
- Patent number 11,545,410
- Issue date Jan 3, 2023
- Intel Corporation
- Mark MacDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented heatsink
- Patent number 11,251,103
- Issue date Feb 15, 2022
- Intel Corporation
- Jerrod Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation shield around a component on a substrate
- Patent number 11,081,450
- Issue date Aug 3, 2021
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Activate loading mechanism
- Patent number 10,880,986
- Issue date Dec 29, 2020
- Intel Corporation
- Evan Piotr Kuklinski
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Induced warpage of a thermal conductor
- Patent number 10,804,168
- Issue date Oct 13, 2020
- Intel Corporation
- Jerrod Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Induced warpage of a thermal conductor
- Patent number 10,418,291
- Issue date Sep 17, 2019
- Intel Corporation
- Jerrod Peterson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD FOR IN-SITU MONITORING OF THERMAL INTERFACE MA...
- Publication number 20240379495
- Publication date Nov 14, 2024
- Intel Corporation
- Smit KAPILA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEMS HAVING PRESTRESSED BIASING ELEMENTS AND...
- Publication number 20230022182
- Publication date Jan 26, 2023
- The Intel Corporation
- Juha Paavola
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNOLOGIES FOR PACKAGE LOADING MECHANISMS
- Publication number 20220336322
- Publication date Oct 20, 2022
- Intel Corporation
- Juha T. Paavola
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND APPARATUS TO PROVIDE ELECTRICAL SHIELDING FOR INTEGRATE...
- Publication number 20210327782
- Publication date Oct 21, 2021
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION
- Publication number 20210101175
- Publication date Apr 8, 2021
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
HEATSINK WITH A SANDWICH PLATE CONSTRUCTION
- Publication number 20200337178
- Publication date Oct 22, 2020
- Intel Corporation
- Juha Tapani Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIATION SHIELD AROUND A COMPONENT ON A SUBSTRATE
- Publication number 20200027844
- Publication date Jan 23, 2020
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCED WARPAGE OF A THERMAL CONDUCTOR
- Publication number 20190371683
- Publication date Dec 5, 2019
- Intel Corporation
- Jerrod Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTED HEATSINK
- Publication number 20190252286
- Publication date Aug 15, 2019
- Intel Corporation
- Jerrod Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVATE LOADING MECHANISM
- Publication number 20190246488
- Publication date Aug 8, 2019
- Intel Corporation
- Evan Piotr Kuklinski
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ENHANCED SYSTEMS AND METHODS FOR IMPROVED HEAT TRANSFER FROM SEMICO...
- Publication number 20190139855
- Publication date May 9, 2019
- Intel Corporation
- Mark MacDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCED WARPAGE OF A THERMAL CONDUCTOR
- Publication number 20190103326
- Publication date Apr 4, 2019
- Intel Corporation
- Jerrod Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TECHNOLOGIES INCORPORATING SUPER-ELASTIC MATERIALS
- Publication number 20190045658
- Publication date Feb 7, 2019
- Intel Corporation
- David Pidwerbecki
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Jerrod Peterson

Person

Patents Grantslast 30 patents

Heatsink with a sandwich plate construction

Liquid metal thermal interface material application

Methods and apparatus to provide electrical shielding for integrate...

Enhanced systems and methods for improved heat transfer from semico...

Segmented heatsink

Radiation shield around a component on a substrate

Activate loading mechanism

Induced warpage of a thermal conductor

Induced warpage of a thermal conductor

Patents Applicationslast 30 patents

STRUCTURE AND METHOD FOR IN-SITU MONITORING OF THERMAL INTERFACE MA...

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

THERMAL MANAGEMENT SYSTEMS HAVING PRESTRESSED BIASING ELEMENTS AND...

TECHNOLOGIES FOR PACKAGE LOADING MECHANISMS

METHODS AND APPARATUS TO PROVIDE ELECTRICAL SHIELDING FOR INTEGRATE...

LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION

HEATSINK WITH A SANDWICH PLATE CONSTRUCTION

RADIATION SHIELD AROUND A COMPONENT ON A SUBSTRATE

INDUCED WARPAGE OF A THERMAL CONDUCTOR

SEGMENTED HEATSINK

ACTIVATE LOADING MECHANISM

ENHANCED SYSTEMS AND METHODS FOR IMPROVED HEAT TRANSFER FROM SEMICO...

INDUCED WARPAGE OF A THERMAL CONDUCTOR

THERMAL TECHNOLOGIES INCORPORATING SUPER-ELASTIC MATERIALS