Jerry Tang

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package mold flow control system and method
- Patent number 12,062,625
- Issue date Aug 13, 2024
- SanDisk Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with exposed bond wires
- Patent number 11,942,459
- Issue date Mar 26, 2024
- Western Digital Technologies, Inc.
- Hua Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE
- Publication number 20240304515
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Exposed Bond Wires
- Publication number 20230260975
- Publication date Aug 17, 2023
- Western Digital Technologies, Inc.
- Hua Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Having Improved Conductive Stub Coverage
- Publication number 20230129628
- Publication date Apr 27, 2023
- Western Digital Technologies, Inc.
- Simon Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Mold Flow Control System and Method
- Publication number 20230102959
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Hope Chiu
- H01 - BASIC ELECTRIC ELEMENTS