Jerry Tzou

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon-based thin substrate and packaging schemes
- Patent number 8,704,383
- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based thin substrate and packaging schemes
- Patent number 8,174,129
- Issue date May 8, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods of forming bonding structures
- Patent number 7,851,331
- Issue date Dec 14, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based thin substrate and packaging schemes
- Patent number 7,804,177
- Issue date Sep 28, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor package
- Patent number 7,446,424
- Issue date Nov 4, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Silicon-Based Thin Substrate and Packaging Schemes
- Publication number 20120199974
- Publication date Aug 9, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES
- Publication number 20110042827
- Publication date Feb 24, 2011
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu Wei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Based Thin Substrate and Packaging Schemes
- Publication number 20100301477
- Publication date Dec 2, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES
- Publication number 20080122114
- Publication date May 29, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-based thin substrate and packaging schemes
- Publication number 20080023850
- Publication date Jan 31, 2008
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20080017956
- Publication date Jan 24, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Utra-thin substrate package technology
- Publication number 20070246821
- Publication date Oct 25, 2007
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Silicon-based thin substrate and packaging schemes

Silicon-based thin substrate and packaging schemes

Bonding structures and methods of forming bonding structures

Silicon-based thin substrate and packaging schemes

Interconnect structure for semiconductor package

Patents Applicationslast 30 patents

Silicon-Based Thin Substrate and Packaging Schemes

BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES

Silicon-Based Thin Substrate and Packaging Schemes

BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES

Silicon-based thin substrate and packaging schemes

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR PACKAGE

Utra-thin substrate package technology