Jeson HSU

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Taichung City, TW

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Patents Applicationslast 30 patents

Information Patent Application
SENSOR CHIP AND SUBSTRATE ASSEMBLY FOR MEMS DEVICE
- Publication number 20080230857
- Publication date Sep 25, 2008
- Lingsen Precicion Industries, LTD.
- Jeson HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY