TREA

Jesse L. Pedigo

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  • La Mesa, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Filling device
    • Patent number 7,066,378
    • Issue date Jun 27, 2006
    • TTM Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Etched hole-fill stand-off
    • Patent number 6,995,321
    • Issue date Feb 7, 2006
    • Honeywell Advanced Circuits
    • Bruce W. Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Compliant pre-form interconnect
    • Patent number 6,923,882
    • Issue date Aug 2, 2005
    • Honeywell International Inc.
    • Nancy E. Iwamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hole filling using an etched hole-fill stand-off
    • Patent number 6,921,505
    • Issue date Jul 26, 2005
    • TTM Advanced Circuits, Inc.
    • Bruce W. Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    PCB support plate for PCB via fill
    • Patent number 6,855,385
    • Issue date Feb 15, 2005
    • TTM Advanced Circuits, Inc.
    • Charles W. Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Scavenging system
    • Patent number 6,840,425
    • Issue date Jan 11, 2005
    • TTM Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heated filling device
    • Patent number 6,832,714
    • Issue date Dec 21, 2004
    • TTM Advanced Circuits, Inc.
    • Jesse Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Filling method
    • Patent number 6,814,918
    • Issue date Nov 9, 2004
    • TTM Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    PCB support plate method for PCB via fill
    • Patent number 6,800,232
    • Issue date Oct 5, 2004
    • TTM Advanced Circuits, Inc.
    • Charles W. Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heated filling method
    • Patent number 6,797,224
    • Issue date Sep 28, 2004
    • TTM Advanced Technologies, Inc.
    • Jesse Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Scavenging method
    • Patent number 6,793,852
    • Issue date Sep 21, 2004
    • TTM Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Filling method
    • Patent number 6,506,332
    • Issue date Jan 14, 2003
    • Honeywell International Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Filling device
    • Patent number 6,454,154
    • Issue date Sep 24, 2002
    • Honeywell Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Via fill formulations which are electrically and/or thermally condu...
    • Patent number 6,312,621
    • Issue date Nov 6, 2001
    • Johnson Matthey Electronics, Inc.
    • Jesse L. Pedigo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of decreasing bleed from organic-based formulations and anti...
    • Patent number 5,859,110
    • Issue date Jan 12, 1999
    • Johnson Matthey, Inc.
    • Nancy E. Iwamoto
    • C40 - COMBINATORIAL CHEMISTRY
  • Information Patent Grant

    Method of decreasing bleed fom organic-based formulations and anti-...
    • Patent number 5,783,621
    • Issue date Jul 21, 1998
    • Johnson Matthey, Inc.
    • Nancy E. Iwamoto
    • C40 - COMBINATORIAL CHEMISTRY
  • Information Patent Grant

    Adhesive composition for bonding a semiconductor device
    • Patent number 5,744,533
    • Issue date Apr 28, 1998
    • Johnson Matthey, Inc.
    • Nancy E. Iwamoto
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

  • Information Patent Application

    Filling method
    • Publication number 20030127777
    • Publication date Jul 10, 2003
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Filling device
    • Publication number 20030057253
    • Publication date Mar 27, 2003
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PCB support plate method for PCB via fill
    • Publication number 20030011098
    • Publication date Jan 16, 2003
    • Charles W. Lewis
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Application

    PCB support plate for PCB via fill
    • Publication number 20020179676
    • Publication date Dec 5, 2002
    • Charles W. Lewis
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Application

    Heated filling method
    • Publication number 20020135104
    • Publication date Sep 26, 2002
    • Jesse Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Compliant pre-form interconnect
    • Publication number 20020136874
    • Publication date Sep 26, 2002
    • Honeywell International Inc.
    • Nancy E. Iwamoto
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Scavenging method
    • Publication number 20020113330
    • Publication date Aug 22, 2002
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Hole filling using an etched hole-fill stand-off
    • Publication number 20020089086
    • Publication date Jul 11, 2002
    • Bruce W. Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Heated filling device
    • Publication number 20020088840
    • Publication date Jul 11, 2002
    • Jesse Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Etched hole-fill stand-off
    • Publication number 20020084306
    • Publication date Jul 4, 2002
    • Bruce W. Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Scavenging system
    • Publication number 20020084305
    • Publication date Jul 4, 2002
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Filling method
    • Publication number 20020084556
    • Publication date Jul 4, 2002
    • Jesse Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR