Jesse Phou

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Stackable molded packages and methods of making the same
- Patent number 8,044,494
- Issue date Oct 25, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH BOND AND PROBE PADS
- Publication number 20140332811
- Publication date Nov 13, 2014
- Naveen Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
- Publication number 20100013065
- Publication date Jan 21, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
- Publication number 20080108179
- Publication date May 8, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable molded packages and methods of making the same
- Publication number 20070141751
- Publication date Jun 21, 2007
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS