Jeyavel Velmurugan

Person

Gaithersburg, MD, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
- Patent number 11,699,590
- Issue date Jul 11, 2023
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition on cobalt lined features
- Patent number 11,168,407
- Issue date Nov 9, 2021
- Lam Research Comporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
- Patent number 10,930,511
- Issue date Feb 23, 2021
- Lam Research Corporation
- Jeyavel Velmurugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper electrodeposition on cobalt lined features
- Patent number 10,648,097
- Issue date May 12, 2020
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20230298894
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING...
- Publication number 20230026818
- Publication date Jan 26, 2023
- LAM RESEARCH CORPORATION
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BYPRODUCT REMOVAL FROM ELECTROPLATING SOLUTIONS
- Publication number 20220307152
- Publication date Sep 29, 2022
- LAM RESEARCH CORPORATION
- Joseph Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20210151322
- Publication date May 20, 2021
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES
- Publication number 20200255964
- Publication date Aug 13, 2020
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES
- Publication number 20190301040
- Publication date Oct 3, 2019
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20190304789
- Publication date Oct 3, 2019
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Jeyavel Velmurugan

Person

Patents Grantslast 30 patents

Copper electrodeposition sequence for the filling of cobalt lined f...

Copper electrodeposition on cobalt lined features

Copper electrodeposition sequence for the filling of cobalt lined f...

Copper electrodeposition on cobalt lined features

Patents Applicationslast 30 patents

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING...

BYPRODUCT REMOVAL FROM ELECTROPLATING SOLUTIONS

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES

COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...