Jheng-Si SU

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 12,076,831
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method
- Patent number 11,673,223
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 11,292,101
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article transporter in semiconductor fabrication
- Patent number 11,251,063
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jheng-Si Su
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing process for forming semiconductor device structure
- Patent number 11,094,554
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Ho Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article transferring method in semiconductor fabrication
- Patent number 10,804,133
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jheng-Si Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CMP SAFE ALIGNMENT MARK
- Publication number 20240387398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Jen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20230264317
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen WEI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD
- Publication number 20220219285
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen WEI
- B24 - GRINDING POLISHING
Information Patent Application
CMP SAFE ALIGNMENT MARK
- Publication number 20220102285
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Jen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARTICLE TRANSPORTER IN SEMICONDUCTOR FABRICATION
- Publication number 20210028049
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jheng-Si SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20190152016
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chen WEI
- B24 - GRINDING POLISHING
Information Patent Application
ARTICLE TRANSFERRING METHOD IN SEMICONDUCTOR FABRICATION
- Publication number 20190157129
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jheng-Si SU
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20180286699
- Publication date Oct 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Ho LIN
- H01 - BASIC ELECTRIC ELEMENTS

Jheng-Si SU

Person

Patents Grantslast 30 patents

Chemical mechanical polishing apparatus and method

Chemical mechanical polishing method

Chemical mechanical polishing apparatus and method

Article transporter in semiconductor fabrication

Polishing process for forming semiconductor device structure

Article transferring method in semiconductor fabrication

Patents Applicationslast 30 patents

CMP SAFE ALIGNMENT MARK

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

CHEMICAL MECHANICAL POLISHING METHOD

CMP SAFE ALIGNMENT MARK

ARTICLE TRANSPORTER IN SEMICONDUCTOR FABRICATION

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

ARTICLE TRANSFERRING METHOD IN SEMICONDUCTOR FABRICATION

POLISHING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE