Ji Cui

Person

Bolinbrook, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Composition and method for polishing and integrated circuit
- Patent number 12,359,090
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry composition and method for polishing and integrated circuit
- Patent number 12,297,375
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry composition, semiconductor structure and method for forming...
- Patent number 12,131,944
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor processing tool and methods of operation
- Patent number 12,068,169
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for chemical mechanical polishing and forming interconnect...
- Patent number 12,002,684
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus including a multi-zone platen
- Patent number 11,772,228
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-CMP cleaning composition for germanium-containing substrate
- Patent number 11,718,812
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ji Cui
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Chemical mechanical polishing slurry composition, method for chemic...
- Patent number 11,658,065
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods for chemical mechanical polishing and forming interconnect...
- Patent number 11,508,585
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- B24 - GRINDING POLISHING
Information Patent Grant
Ion implant process for defect elimination in metal layer planariza...
- Patent number 11,450,565
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...
- Publication number 20250234593
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250038073
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Han SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY COMPOSITION, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240379421
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20240363404
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240363361
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...
- Publication number 20240290629
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen
- Publication number 20230364733
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Hsun Chang
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...
- Publication number 20230082084
- Publication date Mar 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY COMPOSITION, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING...
- Publication number 20230064918
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20220359277
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20220310404
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHOD FOR POLISHING AND INTEGRATED CIRCUIT
- Publication number 20220017780
- Publication date Jan 20, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION, METHOD FOR CHEMIC...
- Publication number 20210391208
- Publication date Dec 16, 2021
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...
- Publication number 20210391186
- Publication date Dec 16, 2021
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-CMP CLEANING COMPOSITION FOR GERMANIUM- CONTAINING SUBSTRATE
- Publication number 20210371774
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ji CUI
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
SLURRY COMPOSITION AND METHOD FOR POLISHING AND INTEGRATGED CIRCUIT
- Publication number 20210371702
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC POLISHING SLURRY AND METHOD FOR POLISHING A WORKPIECE
- Publication number 20210348027
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...
- Publication number 20210305092
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen
- Publication number 20210220964
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Composition and method for polishing and integrated circuit

Slurry composition and method for polishing and integrated circuit

Slurry composition, semiconductor structure and method for forming...

Semiconductor processing tool and methods of operation

Methods for chemical mechanical polishing and forming interconnect...

Chemical mechanical polishing apparatus including a multi-zone platen

Post-CMP cleaning composition for germanium-containing substrate

Chemical mechanical polishing slurry composition, method for chemic...

Methods for chemical mechanical polishing and forming interconnect...

Ion implant process for defect elimination in metal layer planariza...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH BONDING STRUCTURE AND METHOD FOR MANUF...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SLURRY COMPOSITION, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING...

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...

SLURRY COMPOSITION, SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING...

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

COMPOSITION AND METHOD FOR POLISHING AND INTEGRATED CIRCUIT

CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION, METHOD FOR CHEMIC...

METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...

POST-CMP CLEANING COMPOSITION FOR GERMANIUM- CONTAINING SUBSTRATE

SLURRY COMPOSITION AND METHOD FOR POLISHING AND INTEGRATGED CIRCUIT

MAGNETIC POLISHING SLURRY AND METHOD FOR POLISHING A WORKPIECE

ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZA...

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen