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last 30 patents
Information
Patent Grant
Interconnect structure having metal layers enclosing a dielectric
Patent number
11,373,949
Issue date
Jun 28, 2022
Semiconductor Manufacturing International (Shanghai) Corporation
Zuopeng He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate having two semiconductor materials on insulator
Patent number
11,011,410
Issue date
May 18, 2021
Semiconductor Manufacturing International (Shanghai) Corporation
Ji Guang Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing an interconnect structure by forming metal...
Patent number
10,553,536
Issue date
Feb 4, 2020
Semiconductor Manufacturing International (Shanghai) Corporation
Zuopeng He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming interconnect structure with partial copper plating
Patent number
10,347,530
Issue date
Jul 9, 2019
Semiconductor Manufacturing International (Shanghai) Corporation
Ji Guang Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate having two semiconductor materials on insulator
Patent number
10,262,891
Issue date
Apr 16, 2019
Semiconductor Manufacturing International (Shanghai) Corporation
Ji Guang Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transistor and method for forming the same
Patent number
10,199,478
Issue date
Feb 5, 2019
Semiconductor Manufacturing International (Shanghai) Corporation
Herb He Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20200144175
Publication date
May 7, 2020
Semiconductor Manufacturing International (Shanghai) Corporation
Zuopeng HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HAVING TWO SEMICONDUCTOR MATERIALS ON INSULATOR
Publication number
20190244854
Publication date
Aug 8, 2019
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI CORPORATION
Ji Guang ZHU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FLAT CU FORMING WITH PARTIAL CU PLATING
Publication number
20180151426
Publication date
May 31, 2018
Semiconductor Manufacturing International (Shanghai) Corporation
Ji Guang ZHU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20180151488
Publication date
May 31, 2018
Semiconductor Manufacturing International (Shanghai) Corporation
ZUOPENG HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HAVING TWO SEMICONDUCTOR MATERIALS ON INSULATOR
Publication number
20170125287
Publication date
May 4, 2017
Semiconductor Manufacturing International (Beijing) Corporation
Ji Guang ZHU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSISTOR AND METHOD FOR FORMING THE SAME
Publication number
20170104084
Publication date
Apr 13, 2017
Semiconductor Manufacturing International (Beijing) Corporation
HERB HE HUANG
H01 - BASIC ELECTRIC ELEMENTS