Ji-han Ko

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Cover window, method of manufacturing cover window, and display device
- Patent number 12,066,596
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Ji Hyun Ko
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Carrier substrate and packaging method using the same
- Patent number 11,211,273
- Issue date Dec 28, 2021
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having improved thermal discharge and electr...
- Patent number 11,205,637
- Issue date Dec 21, 2021
- Samsung Electronics Co., Ltd.
- Won-keun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards with anti-warping molding portions and relat...
- Patent number 10,847,473
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having improved thermal discharge and electr...
- Patent number 10,797,021
- Issue date Oct 6, 2020
- Samsung Electronics Co., Ltd.
- Won-keun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including chip support and method of fabricat...
- Patent number 9,177,886
- Issue date Nov 3, 2015
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,171,819
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Cheol-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package
- Patent number 8,698,300
- Issue date Apr 15, 2014
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device, and semiconductor module
- Patent number 8,508,044
- Issue date Aug 13, 2013
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma display panel
- Patent number 7,663,317
- Issue date Feb 16, 2010
- Samsung SDI Co., Ltd.
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma display panel having scan electrode closer to address electrode
- Patent number 7,375,468
- Issue date May 20, 2008
- Samsung SDI Co., Ltd.
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma display panel
- Patent number 7,277,067
- Issue date Oct 2, 2007
- Samsung SDI Co., Ltd.
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma display panel having dummy barrier ribs
- Patent number 7,030,560
- Issue date Apr 18, 2006
- Samsung SDI Co., Ltd.
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413203
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Chang Min YOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST METHOD FOR GLASS STRESS
- Publication number 20240118182
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Min Ki KIM
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230109292
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hwail JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER WINDOW, METHOD OF MANUFACTURING COVER WINDOW, AND DISPLAY DEVICE
- Publication number 20220082732
- Publication date Mar 17, 2022
- SAMSUNG DISPLAY CO., LTD.
- Ji Hyun KO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COVER WINDOW AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20210277280
- Publication date Sep 9, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hyun Seung SEO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTR...
- Publication number 20200402952
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- Won-keun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME
- Publication number 20200135498
- Publication date Apr 30, 2020
- Samsung Electronics Co., Ltd.
- Ji-Han KO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTR...
- Publication number 20200075545
- Publication date Mar 5, 2020
- Samsung Electronics Co., Ltd.
- Won-keun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS WITH ANTI-WARPING MOLDING PORTIONS AND RELAT...
- Publication number 20190122995
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150102507
- Publication date Apr 16, 2015
- Samsung Electronics Co., Ltd.
- Cheol-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20140103517
- Publication date Apr 17, 2014
- Samsung Electronics Co., Ltd.
- Sung-Kyu PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130270717
- Publication date Oct 17, 2013
- Samsung Electronics Co., Ltd.
- Ji-Han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE
- Publication number 20130009304
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Ji-han Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MODULE
- Publication number 20110272805
- Publication date Nov 10, 2011
- Ji-Han KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-density multifunctional PoP-type multi-chip package structure
- Publication number 20100155919
- Publication date Jun 24, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- In-Sang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma display panel
- Publication number 20080136327
- Publication date Jun 12, 2008
- Sung-hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma display panel
- Publication number 20080007488
- Publication date Jan 10, 2008
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma display panel
- Publication number 20070228976
- Publication date Oct 4, 2007
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma display panel
- Publication number 20050116896
- Publication date Jun 2, 2005
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma display panel
- Publication number 20050057444
- Publication date Mar 17, 2005
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma display panel having dummy barrier ribs
- Publication number 20040056597
- Publication date Mar 25, 2004
- Ji-Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Cover window, method of manufacturing cover window, and display device

Carrier substrate and packaging method using the same

Semiconductor packages having improved thermal discharge and electr...

Printed circuit boards with anti-warping molding portions and relat...

Semiconductor packages having improved thermal discharge and electr...

Semiconductor package including chip support and method of fabricat...

Semiconductor package

Chip-stacked semiconductor package

Semiconductor package, semiconductor device, and semiconductor module

Plasma display panel

Plasma display panel having scan electrode closer to address electrode

Plasma display panel

Plasma display panel having dummy barrier ribs

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

TEST METHOD FOR GLASS STRESS

SEMICONDUCTOR PACKAGE

COVER WINDOW, METHOD OF MANUFACTURING COVER WINDOW, AND DISPLAY DEVICE

COVER WINDOW AND DISPLAY DEVICE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTR...

CARRIER SUBSTRATE AND PACKAGING METHOD USING THE SAME

SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTR...

PRINTED CIRCUIT BOARDS WITH ANTI-WARPING MOLDING PORTIONS AND RELAT...

SEMICONDUCTOR PACKAGE

PACKAGE SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CHIP-STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MODULE

High-density multifunctional PoP-type multi-chip package structure

Plasma display panel

Plasma display panel

Plasma display panel

Plasma display panel

Plasma display panel

Plasma display panel having dummy barrier ribs