Ji-Hong Chiang

Person

Changhua City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,782,284
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer bonding alignment
- Patent number 11,742,320
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,726,342
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughness selectivity for MEMS movement stiction reduction
- Patent number 11,655,138
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,454,820
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,448,891
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 11,305,980
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heater design for MEMS chamber pressure control
- Patent number 10,532,925
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 10,513,432
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 10,155,656
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heater design for MEMS chamber pressure control
- Patent number 10,131,536
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective nitride outgassing process for MEMS cavity pressure control
- Patent number 9,884,758
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Movement microelectromechanical systems (MEMS) package
- Patent number 9,527,721
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mechanism for forming MEMS device
- Patent number 9,090,452
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20230400699
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20230359056
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING ALIGNMENT
- Publication number 20230352445
- Publication date Nov 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION
- Publication number 20230264945
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20220382069
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20220373815
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G02 - OPTICS
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER BONDING ALIGNMENT
- Publication number 20220293557
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20220242724
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co.,Ltd
- Jui-Chun WENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION
- Publication number 20220135397
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MUTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20210116713
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20210116714
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20200123003
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20190031503
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Chun WENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL
- Publication number 20190010047
- Publication date Jan 10, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20180370790
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELECTIVE NITRIDE OUTGASSING PROCESS FOR MEMS CAVITY PRESSURE CONTROL
- Publication number 20170203962
- Publication date Jul 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL
- Publication number 20170107100
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20170107097
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Movement Microelectromechanical Systems (MEMS) Package
- Publication number 20160332863
- Publication date Nov 17, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MECHANISM FOR FORMING MEMS DEVICE
- Publication number 20150158716
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Ji-Hong Chiang

Person

Patents Grantslast 30 patents

Multifunctional collimator for contact image sensors

Wafer bonding alignment

Multifunctional collimator for contact image sensors

Roughness selectivity for MEMS movement stiction reduction

Multifunctional collimator for contact image sensors

Multifunctional collimator for contact image sensors

Inter-poly connection for parasitic capacitor and die size improvement

Anti-stiction process for MEMS device

Heater design for MEMS chamber pressure control

Anti-stiction process for MEMS device

Inter-poly connection for parasitic capacitor and die size improvement

Heater design for MEMS chamber pressure control

Selective nitride outgassing process for MEMS cavity pressure control

Movement microelectromechanical systems (MEMS) package

Mechanism for forming MEMS device

Patents Applicationslast 30 patents

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

WAFER BONDING ALIGNMENT

ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

WAFER BONDING ALIGNMENT

ANTI-STICTION PROCESS FOR MEMS DEVICE

ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION

MUTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

ANTI-STICTION PROCESS FOR MEMS DEVICE

ANTI-STICTION PROCESS FOR MEMS DEVICE

HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

SELECTIVE NITRIDE OUTGASSING PROCESS FOR MEMS CAVITY PRESSURE CONTROL

HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

Movement Microelectromechanical Systems (MEMS) Package

MECHANISM FOR FORMING MEMS DEVICE