Ji Soo CHO

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus
- Patent number 12,027,486
- Issue date Jul 2, 2024
- L TRIN.CO., LTD
- Yong Won Cha
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20220052018
- Publication date Feb 17, 2022
- L TRIN.CO.,LTD
- Yong Won CHA
- G06 - COMPUTING CALCULATING COUNTING