Jia Gao

Person

Winchester, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated package containing MEMS acoustic sensor and pressure sensor
- Patent number 10,351,419
- Issue date Jul 16, 2019
- Invensense, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone system for harsh environments
- Patent number 9,681,242
- Issue date Jun 13, 2017
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packaging concept to improve performance of a micro-electro mechani...
- Patent number 9,351,084
- Issue date May 24, 2016
- Invensense, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging
- Patent number 9,142,470
- Issue date Sep 22, 2015
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Air-release features in cavity packages
- Patent number 8,853,839
- Issue date Oct 7, 2014
- Analog Devices, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone system for harsh environments
- Patent number 8,841,738
- Issue date Sep 23, 2014
- Invensense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packages and methods for packaging using a lid having multiple cond...
- Patent number 8,723,308
- Issue date May 13, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND PRESSURE SENSOR
- Publication number 20170334714
- Publication date Nov 23, 2017
- InvenSense, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR SEALING A MEMS DEVICE
- Publication number 20160093791
- Publication date Mar 31, 2016
- InvenSense, Inc.
- Anthony D. Minervini
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGING CONCEPT TO IMPROVE PERFORMANCE OF A MICRO-ELECTRO MECHANI...
- Publication number 20160014530
- Publication date Jan 14, 2016
- InvenSense, Inc.
- Jia Gao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS MICROPHONE SYSTEM FOR HARSH ENVIRONMENTS
- Publication number 20150304787
- Publication date Oct 22, 2015
- InvenSense, Inc.
- Kieran P. Harney
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20140332947
- Publication date Nov 13, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Microphone System for Harsh Environments
- Publication number 20140091406
- Publication date Apr 3, 2014
- InvenSense, Inc.
- Kieran P. Harney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR AIR-RELEASE IN CAVITY PACKAGES
- Publication number 20130093031
- Publication date Apr 18, 2013
- Analog Devices, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20120126347
- Publication date May 24, 2012
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Integrated package containing MEMS acoustic sensor and pressure sensor

MEMS microphone system for harsh environments

Packaging concept to improve performance of a micro-electro mechani...

Packages and methods for packaging

Air-release features in cavity packages

MEMS microphone system for harsh environments

Packages and methods for packaging using a lid having multiple cond...

Patents Applicationslast 30 patents

INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND PRESSURE SENSOR

APPARATUS AND METHOD FOR SEALING A MEMS DEVICE

PACKAGING CONCEPT TO IMPROVE PERFORMANCE OF A MICRO-ELECTRO MECHANI...

MEMS MICROPHONE SYSTEM FOR HARSH ENVIRONMENTS

PACKAGES AND METHODS FOR PACKAGING

MEMS Microphone System for Harsh Environments

SYSTEMS AND METHODS FOR AIR-RELEASE IN CAVITY PACKAGES

PACKAGES AND METHODS FOR PACKAGING