Jia-Hung Tseng

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Display including an LED element having a pressure sensitive adhesi...
- Patent number 10,886,153
- Issue date Jan 5, 2021
- Intel Corporation
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro pick and bond assembly
- Patent number 10,242,892
- Issue date Mar 26, 2019
- Intel Corporation
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro pick and bond assembly
- Patent number 10,204,808
- Issue date Feb 12, 2019
- Intel Corporation
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inclined photonic chip package for integrated optical transceivers...
- Patent number 9,420,700
- Issue date Aug 16, 2016
- Intel Corporation
- Gerrit J Vreman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-dimensional, high-density optical connector
- Patent number 9,377,594
- Issue date Jun 28, 2016
- Intel Corporation
- Shawna Liff
- G02 - OPTICS
Information Patent Grant
Inclined photonic chip package for integrated optical transceivers...
- Patent number 9,263,621
- Issue date Feb 16, 2016
- Intel Corporation
- Gerrit J Vreman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Slotted Y-coupling waveguide for slotted waveguide modulator device
- Patent number 9,025,926
- Issue date May 5, 2015
- Intel Corporation
- Peter L. Chang
- G02 - OPTICS
Information Patent Grant
Waveguide integration on laser for alignment-tolerant assembly
- Patent number 8,731,346
- Issue date May 20, 2014
- Intel Corporation
- Jia-Hung Tseng
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
MICRO PICK AND BOND ASSEMBLY
- Publication number 20190148188
- Publication date May 16, 2019
- Intel Corporation
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO PICK AND BOND ASSEMBLY
- Publication number 20170278733
- Publication date Sep 28, 2017
- Peter L. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS...
- Publication number 20160088740
- Publication date Mar 24, 2016
- Intel Corporation
- Gerrit J. VREMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS...
- Publication number 20150185895
- Publication date Jul 2, 2015
- Gerrit J VREMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SLOTTED Y-COUPLING WAVEGUIDE FOR SLOTTED WAVEGUIDE MODULATOR DEVICE
- Publication number 20140199015
- Publication date Jul 17, 2014
- Peter L. Chang
- G02 - OPTICS
Information Patent Application
TWO-DIMENSIONAL, HIGH-DENSITY OPTICAL CONNECTOR
- Publication number 20140153881
- Publication date Jun 5, 2014
- Shawna Liff
- G02 - OPTICS
Information Patent Application
WAVEGUIDE INTEGRATION ON LASER FOR ALIGNMENT-TOLERANT ASSEMBLY
- Publication number 20140003765
- Publication date Jan 2, 2014
- Jia-Hung Tseng
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLING TECHNIQUES AND CONFIGURATIONS BETWEEN DIES
- Publication number 20130336346
- Publication date Dec 19, 2013
- Mauro J. Kobrinsky
- G02 - OPTICS

Jia-Hung Tseng

Person

Patents Grantslast 30 patents

Display including an LED element having a pressure sensitive adhesi...

Micro pick and bond assembly

Micro pick and bond assembly

Inclined photonic chip package for integrated optical transceivers...

Two-dimensional, high-density optical connector

Inclined photonic chip package for integrated optical transceivers...

Slotted Y-coupling waveguide for slotted waveguide modulator device

Waveguide integration on laser for alignment-tolerant assembly

Patents Applicationslast 30 patents

MICRO PICK AND BOND ASSEMBLY

MICRO PICK AND BOND ASSEMBLY

INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS...

INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS...

SLOTTED Y-COUPLING WAVEGUIDE FOR SLOTTED WAVEGUIDE MODULATOR DEVICE

TWO-DIMENSIONAL, HIGH-DENSITY OPTICAL CONNECTOR

WAVEGUIDE INTEGRATION ON LASER FOR ALIGNMENT-TOLERANT ASSEMBLY

OPTICAL COUPLING TECHNIQUES AND CONFIGURATIONS BETWEEN DIES