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Klang, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Copper ball bond interface structure and formation
Patent number
9,257,403
Issue date
Feb 9, 2016
FREESCALE SEMICONDUCTOR, INC.
Tu-Anh N. Tran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame with power bar for semiconductor device
Patent number
8,933,547
Issue date
Jan 13, 2015
FREESCALE SEMICONDUCTOR, INC.
Jia Lin Yap
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with inner and outer leads
Patent number
8,853,840
Issue date
Oct 7, 2014
FREESCALE SEMICONDUCTOR, INC.
Yin Kheng Au
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH INTERIOR LEADS
Publication number
20150206829
Publication date
Jul 23, 2015
Yin Kheng Au
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper Ball Bond Interface Structure and Formation
Publication number
20150145148
Publication date
May 28, 2015
FREESCALE SEMICONDUCTOR, INC.
Tu-Anh N. Tran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME WITH INTERPOSER
Publication number
20150075849
Publication date
Mar 19, 2015
Jia Lin Yap
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
Publication number
20140374467
Publication date
Dec 25, 2014
Jia Lin Yap
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING METHOD FOR FLEXIBLE SUBSTRATES
Publication number
20140374151
Publication date
Dec 25, 2014
Jia Lin Yap
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE BONDING APPARATUS AND METHOD
Publication number
20140263584
Publication date
Sep 18, 2014
Jia Lin Yap
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH INNER AND OUTER LEADS
Publication number
20140231978
Publication date
Aug 21, 2014
Yin Kheng Au
H01 - BASIC ELECTRIC ELEMENTS