Jia-Ling Ko

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,672
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structure and method of manufa...
- Patent number 10,672,737
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240347506
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200294966
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...
- Publication number 20190139935
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS