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Jia-Wei Pan

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  • Taichung, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC PACKAGE
    • Publication number 20210280530
    • Publication date Sep 9, 2021
    • Siliconware Precision Industries Co., Ltd.
    • Chi-Jen Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE
    • Publication number 20170256481
    • Publication date Sep 7, 2017
    • Siliconware Precision Industries Co., Ltd.
    • Shih-Ching Chen
    • H01 - BASIC ELECTRIC ELEMENTS