Jia Wen WANG

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,462,503
- Issue date Oct 4, 2022
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and structure thereof
- Patent number 11,342,185
- Issue date May 24, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts and dummy interconnects
- Patent number 11,205,619
- Issue date Dec 21, 2021
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,049,834
- Issue date Jun 29, 2021
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 10,833,042
- Issue date Nov 10, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts and dummy interconnects
- Patent number 10,748,851
- Issue date Aug 18, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and structure thereof
- Patent number 10,679,854
- Issue date Jun 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 10,580,788
- Issue date Mar 3, 2020
- Yangtze Memory Technologies, Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS
- Publication number 20210035941
- Publication date Feb 4, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS
- Publication number 20200335450
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20200273706
- Publication date Aug 27, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS
- Publication number 20200243455
- Publication date Jul 30, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS
- Publication number 20200243473
- Publication date Jul 30, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ALIGNMENT MARKS AT BONDING INTERFACE
- Publication number 20200159133
- Publication date May 21, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Meng Yan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20200027892
- Publication date Jan 23, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jifeng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND STRUCTURE THEREOF
- Publication number 20190051524
- Publication date Feb 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- H01 - BASIC ELECTRIC ELEMENTS

Jia Wen WANG

Person

Patents Grantslast 30 patents

Hybrid bonding using dummy bonding contacts

Wafer bonding method and structure thereof

Hybrid bonding using dummy bonding contacts and dummy interconnects

Hybrid bonding using dummy bonding contacts

Hybrid bonding using dummy bonding contacts

Hybrid bonding using dummy bonding contacts and dummy interconnects

Wafer bonding method and structure thereof

Methods for forming three-dimensional memory devices

Patents Applicationslast 30 patents

HYBRID BONDING USING DUMMY BONDING CONTACTS

HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS

WAFER BONDING METHOD AND STRUCTURE THEREOF

HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS

HYBRID BONDING USING DUMMY BONDING CONTACTS

BONDING ALIGNMENT MARKS AT BONDING INTERFACE

METHODS FOR FORMING THREE-DIMENSIONAL MEMORY DEVICES

WAFER BONDING METHOD AND STRUCTURE THEREOF