JIA YAN GO

Person

KULIM, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling systems, cooling structures and electronic devices and meth...
- Patent number 12,284,793
- Issue date Apr 22, 2025
- Intel Corporation
- Ritu Bawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device packaging
- Patent number 11,133,261
- Issue date Sep 28, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional decoupling integration within hole in motherboard
- Patent number 11,006,514
- Issue date May 11, 2021
- Intel Corporation
- Jia Yan Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference (EMI) shield for circuit card assembly...
- Patent number 10,856,454
- Issue date Dec 1, 2020
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly that includes a substrate bridge
- Patent number 10,492,299
- Issue date Nov 26, 2019
- Intel Corporation
- Eng Huat Goh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Interconnects for semiconductor packages
- Patent number 10,163,777
- Issue date Dec 25, 2018
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES
- Publication number 20250016930
- Publication date Jan 9, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES AND METH...
- Publication number 20230337406
- Publication date Oct 19, 2023
- Intel Corporation
- Ritu BAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND APPARATUS TO INCREASE RIGIDITY OF PRINTED CIRCUIT BOARDS
- Publication number 20230108868
- Publication date Apr 6, 2023
- Intel Corporation
- Jia Yan Go
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL DECOUPLING INTEGRATION WITHIN HOLE IN MOTHERBOARD
- Publication number 20190394871
- Publication date Dec 26, 2019
- Intel Corporation
- Jia Yan GO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD FOR CIRCUIT CARD ASSEMBLY...
- Publication number 20190364702
- Publication date Nov 28, 2019
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE PACKAGING
- Publication number 20190103358
- Publication date Apr 4, 2019
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A SUBSTRATE BRIDGE
- Publication number 20180324951
- Publication date Nov 8, 2018
- Intel Corporation
- Penang Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20180286804
- Publication date Oct 4, 2018
- Intel Corporation
- SEOK LING LIM
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Cooling systems, cooling structures and electronic devices and meth...

Electronic device packaging

Three-dimensional decoupling integration within hole in motherboard

Electromagnetic interference (EMI) shield for circuit card assembly...

Electronic assembly that includes a substrate bridge

Interconnects for semiconductor packages

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES

COOLING SYSTEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES AND METH...

METHODS AND APPARATUS TO INCREASE RIGIDITY OF PRINTED CIRCUIT BOARDS

THREE-DIMENSIONAL DECOUPLING INTEGRATION WITHIN HOLE IN MOTHERBOARD

ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD FOR CIRCUIT CARD ASSEMBLY...

ELECTRONIC DEVICE PACKAGING

ELECTRONIC ASSEMBLY THAT INCLUDES A SUBSTRATE BRIDGE

INTERCONNECTS FOR SEMICONDUCTOR PACKAGES