Jia Yi WONG

Person

Jalan Air Leleh, Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
- Patent number 11,756,917
- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a semiconductor device
- Patent number 11,217,529
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Stefan Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, leadframe for an electronic device and method fo...
- Patent number 11,107,754
- Issue date Aug 31, 2021
- Infineon Technologies AG
- Jia Yi Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a cooling surface and method of m...
- Patent number 10,727,151
- Issue date Jul 28, 2020
- Infineon Technologies AG
- Liu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rivetless lead fastening for a semiconductor package
- Patent number 10,431,526
- Issue date Oct 1, 2019
- Cree, Inc.
- Kar Meng Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for forming and protecting thin films on sub...
- Patent number 8,877,617
- Issue date Nov 4, 2014
- SunPower Corporation
- Jia Yi Wong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
- Publication number 20230411336
- Publication date Dec 21, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...
- Publication number 20210305198
- Publication date Sep 30, 2021
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGES
- Publication number 20210043549
- Publication date Feb 11, 2021
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20200111750
- Publication date Apr 9, 2020
- INFINEON TECHNOLOGIES AG
- Stefan Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rivetless Lead Fastening for a Semiconductor Package
- Publication number 20190109070
- Publication date Apr 11, 2019
- INFINEON TECHNOLOGIES AG
- Kar Meng Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, LEADFRAME FOR AN ELECTRONIC DEVICE AND METHOD FO...
- Publication number 20180358287
- Publication date Dec 13, 2018
- INFINEON TECHNOLOGIES AG
- Jia Yi Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having a Cooling Surface and Method of M...
- Publication number 20180342438
- Publication date Nov 29, 2018
- INFINEON TECHNOLOGIES AG
- Liu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR FORMING AND PROTECTING THIN FILMS ON SUB...
- Publication number 20140087496
- Publication date Mar 27, 2014
- SunPower Corporation
- Jia Yi WONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Jia Yi WONG

Person

Patents Grantslast 30 patents

Method for processing a semiconductor wafer, semiconductor wafer, c...

Semiconductor device and method of forming a semiconductor device

Electronic device, leadframe for an electronic device and method fo...

Semiconductor chip package having a cooling surface and method of m...

Rivetless lead fastening for a semiconductor package

Methods and structures for forming and protecting thin films on sub...

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...

CLIPS FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE

Rivetless Lead Fastening for a Semiconductor Package

ELECTRONIC DEVICE, LEADFRAME FOR AN ELECTRONIC DEVICE AND METHOD FO...

Semiconductor Chip Package Having a Cooling Surface and Method of M...

METHODS AND STRUCTURES FOR FORMING AND PROTECTING THIN FILMS ON SUB...