Jialan He

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Protection structures in semiconductor chips and methods for formin...
- Patent number 11,791,229
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for multi-wafer stacking and dicing
- Patent number 11,710,717
- Issue date Jul 25, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-deck plug in three-dimensional memory device and method for f...
- Patent number 10,892,280
- Issue date Jan 12, 2021
- Yangtze Memory Technologies Co., Ltd.
- Qianbin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flatness control using backside compensation structure
- Patent number 10,763,099
- Issue date Sep 1, 2020
- Yangtze Memory Technologies Co., Ltd.
- Xiaowang Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-deck plug in three-dimensional memory device and method for f...
- Patent number 10,741,578
- Issue date Aug 11, 2020
- Yangtze Memory Technologies Co., Ltd.
- Qianbin Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR MULTI-WAFER STACKING AND DICING
- Publication number 20230307413
- Publication date Sep 28, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION STRUCTURES IN SEMICONDUCTOR CHIPS AND METHODS FOR FORMIN...
- Publication number 20210280481
- Publication date Sep 9, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MULTI-WAFER STACKING AND DICING
- Publication number 20210210460
- Publication date Jul 8, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-DECK PLUG IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR F...
- Publication number 20200335515
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Qianbin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-DECK PLUG IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR F...
- Publication number 20200111807
- Publication date Apr 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Qianbin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FLATNESS CONTROL USING BACKSIDE COMPENSATION STRUCTURE
- Publication number 20200058486
- Publication date Feb 20, 2020
- Yangtze Memory Technologies Co., Ltd.
- Xiaowang Dai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Person

Patents Grantslast 30 patents

Protection structures in semiconductor chips and methods for formin...

Methods for multi-wafer stacking and dicing

Inter-deck plug in three-dimensional memory device and method for f...

Wafer flatness control using backside compensation structure

Inter-deck plug in three-dimensional memory device and method for f...

Patents Applicationslast 30 patents

METHODS FOR MULTI-WAFER STACKING AND DICING

PROTECTION STRUCTURES IN SEMICONDUCTOR CHIPS AND METHODS FOR FORMIN...

METHODS FOR MULTI-WAFER STACKING AND DICING

INTER-DECK PLUG IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR F...

INTER-DECK PLUG IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR F...

WAFER FLATNESS CONTROL USING BACKSIDE COMPENSATION STRUCTURE