Jiali Wu

Person

Atlanta, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally conductive interface composition and use thereof
- Patent number 10,190,031
- Issue date Jan 29, 2019
- Jiali Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Cu-low K cleaning and protection compositions
- Patent number 9,490,142
- Issue date Nov 8, 2016
- Qualsig Inc.
- Jiali Wu
- B08 - CLEANING
Information Patent Grant
Thermal conductivity improved composition with addition of nano par...
- Patent number 9,157,019
- Issue date Oct 13, 2015
- Jiali Wu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reworkable underfills for ceramic MCM C4 protection
- Patent number 8,492,199
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve wettability by reducing liquid polymer macromolec...
- Patent number 7,932,342
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Steven E Molis
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Liquid thermal interface having mixture of linearly structured poly...
- Patent number 7,808,099
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Randall J. Bertrand
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Crosstalk reduction in dual inline memory module (DIMM) connectors
- Patent number 7,537,487
- Issue date May 26, 2009
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk reduction in dual inline memory module (DIMM) connectors
- Patent number 7,407,415
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress conformal coatings of reliability without hermeticity fo...
- Patent number 6,989,433
- Issue date Jan 24, 2006
- Georgia Tech Research Corp.
- Ching Ping Wong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Reworkable high temperature adhesives
- Patent number 6,380,322
- Issue date Apr 30, 2002
- Georgia Tech Research Corporation
- Ching-Ping Wong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Processing Composition of Improved Metal Interconnect Protection an...
- Publication number 20190048292
- Publication date Feb 14, 2019
- Jiali Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Conductive Interface Composition and Use Thereof
- Publication number 20170349801
- Publication date Dec 7, 2017
- Jiali Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Cu-Low K Cleaning and Protection Compositions
- Publication number 20160300730
- Publication date Oct 13, 2016
- Qualsig Incorporation
- Jiali Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Microscale Interface Materials for Enhancement of Electronics Perfo...
- Publication number 20160096987
- Publication date Apr 7, 2016
- Qualsig Incorporation
- Jiali Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Conductivity Improved Composition with Addition of Nano Par...
- Publication number 20140293546
- Publication date Oct 2, 2014
- Jiali Wu
- B82 - NANO-TECHNOLOGY
Information Patent Application
NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
- Publication number 20120021567
- Publication date Jan 26, 2012
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID THERMAL INTERFACE HAVING MIXTURE OF LINEARLY STRUCTURED POLY...
- Publication number 20090281254
- Publication date Nov 12, 2009
- International Business Machines Corporation
- Randall J. Bertrand
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD TO IMPROVE WETTABILITY BY REDUCING LIQUID POLYMER MACROMOLEC...
- Publication number 20090182161
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Steven E. MOLIS
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CROSSTALK REDUCTION IN DUAL INLINE MEMORY MODULE (DIMM) CONNECTORS
- Publication number 20080207059
- Publication date Aug 28, 2008
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20080076690
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
- Publication number 20070290378
- Publication date Dec 20, 2007
- International Business Machines Corporation
- Jeffrey T. Coffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK REDUCTION IN DUAL INLINE MEMORY MODULE (DIMM) CONNECTORS
- Publication number 20070287333
- Publication date Dec 13, 2007
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20050066995
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Thermally conductive interface composition and use thereof

Cu-low K cleaning and protection compositions

Thermal conductivity improved composition with addition of nano par...

Reworkable underfills for ceramic MCM C4 protection

Method to improve wettability by reducing liquid polymer macromolec...

Liquid thermal interface having mixture of linearly structured poly...

Crosstalk reduction in dual inline memory module (DIMM) connectors

Crosstalk reduction in dual inline memory module (DIMM) connectors

Low stress conformal coatings of reliability without hermeticity fo...

Reworkable high temperature adhesives

Patents Applicationslast 30 patents

Processing Composition of Improved Metal Interconnect Protection an...

Thermally Conductive Interface Composition and Use Thereof

Cu-Low K Cleaning and Protection Compositions

Microscale Interface Materials for Enhancement of Electronics Perfo...

Thermal Conductivity Improved Composition with Addition of Nano Par...

NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION

LIQUID THERMAL INTERFACE HAVING MIXTURE OF LINEARLY STRUCTURED POLY...

METHOD TO IMPROVE WETTABILITY BY REDUCING LIQUID POLYMER MACROMOLEC...

CROSSTALK REDUCTION IN DUAL INLINE MEMORY MODULE (DIMM) CONNECTORS

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION

CROSSTALK REDUCTION IN DUAL INLINE MEMORY MODULE (DIMM) CONNECTORS

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK