Jialing Tong

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) package with stacked die wire bond connecti...
- Patent number 11,676,905
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DRY ETCH BACK SUBSTRATE INTERCONNECTIONS
- Publication number 20220108918
- Publication date Apr 7, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTI...
- Publication number 20220037257
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS