Jiamiao (John) Tang

Person

Shanghi, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible system-in-package solutions for wearable devices
- Patent number 9,778,688
- Issue date Oct 3, 2017
- Intel Corporation
- Jiamiao Tang
- A43 - FOOTWEAR
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,385,094
- Issue date Jul 5, 2016
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,981,573
- Issue date Mar 17, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,963,333
- Issue date Feb 24, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,513,108
- Issue date Aug 20, 2013
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,084,867
- Issue date Dec 27, 2011
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual heat spreader panel assembly method for bumpless die-attach pa...
- Patent number 7,723,164
- Issue date May 25, 2010
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with lossy material insert
- Patent number 7,714,430
- Issue date May 11, 2010
- Intel Corporation
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-chip integrated heat spreader assembly, packages containing sa...
- Patent number 7,659,143
- Issue date Feb 9, 2010
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing input capacitance of high speed integrated circuits
- Patent number 7,535,689
- Issue date May 19, 2009
- Intel Corporation
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-to-chip optical interconnect
- Patent number 7,373,033
- Issue date May 13, 2008
- Intel Corporation
- Daoqiang Lu
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20160379920
- Publication date Dec 29, 2016
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SYSTEM-IN-PACKAGE SOLUTIONS FOR WEARABLE DEVICES
- Publication number 20160327977
- Publication date Nov 10, 2016
- Intel Corporation
- Jiamiao Tang
- A41 - WEARING APPAREL
Information Patent Application
Wearable Personal Computer and Healthcare Devices
- Publication number 20160324487
- Publication date Nov 10, 2016
- Intel Corporation
- Mao GUO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20150187713
- Publication date Jul 2, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20140042639
- Publication date Feb 13, 2014
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20130334707
- Publication date Dec 19, 2013
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20120108053
- Publication date May 3, 2012
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20100244268
- Publication date Sep 30, 2010
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A THIN TIM CORELESS HIGH DENSITY BUMP-LESS PACKA...
- Publication number 20090079064
- Publication date Mar 26, 2009
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing input capacitance for high speed integrated circuits
- Publication number 20080316662
- Publication date Dec 25, 2008
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with lossy material insert
- Publication number 20080102565
- Publication date May 1, 2008
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-CHIP INTEGRATED HEAT SPREADER ASSEMBLY, PACKAGES CONTAINING SA...
- Publication number 20080079144
- Publication date Apr 3, 2008
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL HEAT SPREADER PANEL ASSEMBLY METHOD FOR BUMPLESS DIE-ATTACH PA...
- Publication number 20080054448
- Publication date Mar 6, 2008
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TO-CHIP OPTICAL INTERCONNECT
- Publication number 20070297713
- Publication date Dec 27, 2007
- Daoqiang Lu
- G02 - OPTICS

Jiamiao (John) Tang

Person

Patents Grantslast 30 patents

Apparatus, system, and method for wireless connection in integrated...

Flexible system-in-package solutions for wearable devices

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Dual heat spreader panel assembly method for bumpless die-attach pa...

Substrate with lossy material insert

Dual-chip integrated heat spreader assembly, packages containing sa...

Reducing input capacitance of high speed integrated circuits

Chip-to-chip optical interconnect

Patents Applicationslast 30 patents

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

FLEXIBLE SYSTEM-IN-PACKAGE SOLUTIONS FOR WEARABLE DEVICES

Wearable Personal Computer and Healthcare Devices

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

METHODS OF FORMING A THIN TIM CORELESS HIGH DENSITY BUMP-LESS PACKA...

Reducing input capacitance for high speed integrated circuits

Substrate with lossy material insert

DUAL-CHIP INTEGRATED HEAT SPREADER ASSEMBLY, PACKAGES CONTAINING SA...

DUAL HEAT SPREADER PANEL ASSEMBLY METHOD FOR BUMPLESS DIE-ATTACH PA...

CHIP-TO-CHIP OPTICAL INTERCONNECT