Jiaming Zhang

Person

Macungie, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Opto-electronic package and a method for making an opto-electronic...
- Patent number 11,803,021
- Issue date Oct 31, 2023
- Infinera Corporation
- Franklin Wall
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,290,619
- Issue date May 14, 2019
- Infinera Corporation
- Peter W. Evans
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,037,982
- Issue date Jul 31, 2018
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,026,723
- Issue date Jul 17, 2018
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Grant
Clamp interconnect
- Patent number 9,711,879
- Issue date Jul 18, 2017
- Infinera Corporation
- John Michael Coronati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bridge assembly for photonic integrated circuits
- Patent number 9,389,441
- Issue date Jul 12, 2016
- Infinera Corporation
- David Gerald Coult
- G02 - OPTICS
Information Patent Grant
Two-shelf interconnect
- Patent number 8,389,978
- Issue date Mar 5, 2013
- Infinera Corporation
- Donald J. Pavinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC PACKAGE HIGH BANDWIDTH RF FEEDTHROUGH
- Publication number 20250096448
- Publication date Mar 20, 2025
- Infinera Corporation
- Jiaming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY RF PACKAGE CONFIGURATIONS
- Publication number 20240282722
- Publication date Aug 22, 2024
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PASS FILTER FOR TROSA HIGH FREQUENCY RESPONSE SUPPRESSION
- Publication number 20230291410
- Publication date Sep 14, 2023
- Infinera Corporation
- Jiaming Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT PACKAGE
- Publication number 20220238449
- Publication date Jul 28, 2022
- Infinera Corp.
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Opto-Electronic Package and a Method for Making an Opto-Electronic...
- Publication number 20210302671
- Publication date Sep 30, 2021
- Infinera Corp.
- Franklin Wall
- G02 - OPTICS
Information Patent Application
HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONI...
- Publication number 20190391348
- Publication date Dec 26, 2019
- Infinera Corporation
- John Osenbach
- G02 - OPTICS
Information Patent Application
SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...
- Publication number 20190342010
- Publication date Nov 7, 2019
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
INTERPOSER ON CARRIER INTEGRATED CIRCUIT MOUNT
- Publication number 20190341359
- Publication date Nov 7, 2019
- Infinera Corporation
- Jie Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...
- Publication number 20190342009
- Publication date Nov 7, 2019
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...
- Publication number 20190339468
- Publication date Nov 7, 2019
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO
- Publication number 20180351684
- Publication date Dec 6, 2018
- Infinera Corparation
- John Osenbach
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194310
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194308
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194309
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
Clamp Interconnect
- Publication number 20160043489
- Publication date Feb 11, 2016
- Infinera Corp.
- John Michael Coronati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Bridge Assembly for Photonic Integrated Circuits
- Publication number 20150180580
- Publication date Jun 25, 2015
- David Gerald Coult
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TWO-SHELF INTERCONNECT
- Publication number 20110204507
- Publication date Aug 25, 2011
- Infinera Corporation
- Donald J. Pavinski, JR.
- H01 - BASIC ELECTRIC ELEMENTS

Jiaming Zhang

Person

Patents Grantslast 30 patents

Opto-electronic package and a method for making an opto-electronic...

Photonic integrated circuit package

Photonic integrated circuit package

Photonic integrated circuit package

Clamp interconnect

Interconnect bridge assembly for photonic integrated circuits

Two-shelf interconnect

Patents Applicationslast 30 patents

CERAMIC PACKAGE HIGH BANDWIDTH RF FEEDTHROUGH

BALL GRID ARRAY RF PACKAGE CONFIGURATIONS

LOW PASS FILTER FOR TROSA HIGH FREQUENCY RESPONSE SUPPRESSION

HYBRID INTEGRATED CIRCUIT PACKAGE

Opto-Electronic Package and a Method for Making an Opto-Electronic...

HETEROGENEOUS COMMON SUBSTRATE MULTI-CHIP PACKAGE INCLUDING PHOTONI...

SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...

INTERPOSER ON CARRIER INTEGRATED CIRCUIT MOUNT

SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...

SPARE CHANNELS ON PHOTONIC INTEGRATED CIRCUITS AND IN PHOTONIC INTE...

OPTICAL MODULES HAVING AN IMPROVED OPTICAL SIGNAL TO NOISE RATIO

PHOTONIC INTEGRATED CIRCUIT PACKAGE

PHOTONIC INTEGRATED CIRCUIT PACKAGE

PHOTONIC INTEGRATED CIRCUIT PACKAGE

Clamp Interconnect

Interconnect Bridge Assembly for Photonic Integrated Circuits

TWO-SHELF INTERCONNECT