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PACKAGE COMPONENT
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Publication number 20240215150
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Publication date Jun 27, 2024
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Taiwan Semiconductor Manufacturing company Ltd.
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CHUN-WEI CHANG
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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COOLING SYSTEM
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Publication number 20240215207
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Publication date Jun 27, 2024
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Giga Computing Technology Co., Ltd.
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Jian-Hung Lin
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F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
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HEAT SINK AND ELECTRONIC DEVICE
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Publication number 20240145338
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Publication date May 2, 2024
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Giga Computing Technology Co., Ltd.
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Jian-Hung Lin
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H01 - BASIC ELECTRIC ELEMENTS
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WAFER TRANSPORTING METHOD
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Publication number 20240087933
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing company Ltd.
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YOU-CHENG YEH
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H01 - BASIC ELECTRIC ELEMENTS
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HEAT DISSIPATION SYSTEM
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Publication number 20240057286
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Publication date Feb 15, 2024
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Giga Computing Technology Co., Ltd.
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Jian-Hung Lin
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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GRAPHENE-CLAD METAL INTERCONNECT
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Publication number 20230402385
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Publication date Dec 14, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Jian-Hong LIN
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H01 - BASIC ELECTRIC ELEMENTS
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GRAPHENE-METAL HYBRID INTERCONNECT
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Publication number 20230402384
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Publication date Dec 14, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Jian-Hong LIN
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H01 - BASIC ELECTRIC ELEMENTS