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Patents Grantslast 30 patents

Information Patent Grant
Flexible sinter tool for bonding semiconductor devices
- Patent number 11,676,937
- Issue date Jun 13, 2023
- ASMPT SINGAPORE PTE. LTD.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
- Publication number 20240030181
- Publication date Jan 25, 2024
- ASMPT SINGAPORE PTE. LTD
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20220359459
- Publication date Nov 10, 2022
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20190080939
- Publication date Mar 14, 2019
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS