Jian Lu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure
- Patent number 11,462,440
- Issue date Oct 4, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and fabrication methods thereof
- Patent number 10,685,831
- Issue date Jun 16, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 10,672,662
- Issue date Jun 2, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE
- Publication number 20200258781
- Publication date Aug 13, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20190035686
- Publication date Jan 31, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
- Publication number 20180337038
- Publication date Nov 22, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Internet of Things Configuration Method and System for Secure Low-P...
- Publication number 20180176079
- Publication date Jun 21, 2018
- Espressif Systems (Shanghai) Pte. Ltd.
- Swee Ann Teo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE