Jian Lu

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structure
- Patent number 11,462,440
- Issue date Oct 4, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internet of things configuration method and system for secure low-p...
- Patent number 10,756,964
- Issue date Aug 25, 2020
- Espressif Systems (Shanghai) Co., Ltd.
- Swee Ann Teo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor structures and fabrication methods thereof
- Patent number 10,685,831
- Issue date Jun 16, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 10,672,662
- Issue date Jun 2, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wireless Power Communication Apparatus and Method
- Publication number 20240313586
- Publication date Sep 19, 2024
- Nuvolta Technologies (Hefei) Co., Ltd.
- Zeng Li
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230207694
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE
- Publication number 20200258781
- Publication date Aug 13, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20190035686
- Publication date Jan 31, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Gang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
- Publication number 20180337038
- Publication date Nov 22, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Internet of Things Configuration Method and System for Secure Low-P...
- Publication number 20180176079
- Publication date Jun 21, 2018
- Espressif Systems (Shanghai) Pte. Ltd.
- Swee Ann Teo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Packaging structure

Internet of things configuration method and system for secure low-p...

Semiconductor structures and fabrication methods thereof

Packaging structure and fabrication method thereof

Patents Applicationslast 30 patents

Wireless Power Communication Apparatus and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE

PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF

Internet of Things Configuration Method and System for Secure Low-P...