TREA

Jian Miremadi

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  • Sunnyvale, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Area matched package
    • Patent number 5,889,332
    • Issue date Mar 30, 1999
    • Hewlett-Packard Company
    • Robert M. Lawson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multiple chip assembly
    • Patent number 5,854,507
    • Issue date Dec 29, 1998
    • Hewlett-Packard Company
    • Jian Miremadi
    • H01 - BASIC ELECTRIC ELEMENTS