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Zhejiang, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Supportable package device and package assembly
Patent number
11,942,263
Issue date
Mar 26, 2024
Silergy Semiconductor Technology (Hangzhou) Ltd.
Jian Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for power supply module
Patent number
11,887,942
Issue date
Jan 30, 2024
Hefei Silergy Semiconductor Technology Co., Ltd.
Ke Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package assembly and method for manufacturing the same, package ass...
Patent number
11,302,595
Issue date
Apr 12, 2022
Hefei Silergy Semiconductor Technology Co., Ltd.
Ke Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and LED illumination module
Patent number
10,928,047
Issue date
Feb 23, 2021
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TRANSFORMER AND PACKAGE MODULE
Publication number
20220254561
Publication date
Aug 11, 2022
Hefei Silergy Semiconductor Technology Co., Ltd.
Ke Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER TRANSFORMER AND METHOD FOR MANUFACTURING THE SAME
Publication number
20210193368
Publication date
Jun 24, 2021
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Ke Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE FOR POWER SUPPLY MODULE
Publication number
20210159194
Publication date
May 27, 2021
Nanjing Silergy Micro Technology Co., Ltd.
Ke Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME, PACKAGE ASS...
Publication number
20210098329
Publication date
Apr 1, 2021
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Ke Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATED TRANSFORMER AND MANUFACTURING METHOD THEREOF
Publication number
20200211759
Publication date
Jul 2, 2020
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Ke Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUPPORTABLE PACKAGE DEVICE AND PACKAGE ASSEMBLY
Publication number
20200152372
Publication date
May 14, 2020
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Jian Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Structure and LED Illumination Module
Publication number
20190301715
Publication date
Oct 3, 2019
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Wei CHEN
F21 - LIGHTING