Jian-Wen Luo

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Kaohsiung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming solder bumps of increased height
- Patent number 7,459,386
- Issue date Dec 2, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsin Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming solder bumps of increased height
- Publication number 20060105560
- Publication date May 18, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsin Tseng
- H01 - BASIC ELECTRIC ELEMENTS