Jian Wen

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Capacitive pressure sensor in an overmolded package
- Patent number 9,146,170
- Issue date Sep 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jian Wen
- G01 - MEASURING TESTING
Information Patent Grant
Lead frame for semiconductor package with enhanced stress relief
- Patent number 8,836,091
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having a flag with in-plane and out-of-plane mold lockin...
- Patent number 8,742,555
- Issue date Jun 3, 2014
- Jian Wen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF
- Publication number 20140264793
- Publication date Sep 18, 2014
- Kai Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE PRESSURE SENSOR IN AN OVERMOLDED PACKAGE
- Publication number 20140033814
- Publication date Feb 6, 2014
- Jian Wen
- G01 - MEASURING TESTING
Information Patent Application
LEAD FRAME HAVING A FLAG WITH IN-PLANE AND OUT-OF-PLANE MOLD LOCKIN...
- Publication number 20130049181
- Publication date Feb 28, 2013
- Jian Wen
- H01 - BASIC ELECTRIC ELEMENTS