Jian-Xheng Liu

Person

  • Taichung, TW

Patents Grantslast 30 patents

  • Information Patent Grant

    Multi-chip semiconductor package

    • Patent number 6,495,908
    • Issue date Dec 17, 2002
    • Siliconware Precision Industries, Co., Ltd.
    • Cheng-Hsung Yang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTI-CHIP SEMICONDUCTOR PACKAGE

    • Publication number 20020149103
    • Publication date Oct 17, 2002
    • Siliconware Precision Industries Co., Ltd.
    • Cheng-Hsung Yang
    • H01 - BASIC ELECTRIC ELEMENTS