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Jian Xie

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  • Singapore, SG
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of fabricating an air gap
    • Patent number 12,191,195
    • Issue date Jan 7, 2025
    • United Microelectronics Corp.
    • Bo Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor structure
    • Patent number 11,923,373
    • Issue date Mar 5, 2024
    • United Microelectronics Corp.
    • Bo Tao
    • G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR STRUCTURE
    • Publication number 20240170490
    • Publication date May 23, 2024
    • UNITED MICROELECTRONICS CORP.
    • BO TAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE
    • Publication number 20230082878
    • Publication date Mar 16, 2023
    • UNITED MICROELECTRONICS CORP.
    • BO TAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING AN AIR GAP
    • Publication number 20230058468
    • Publication date Feb 23, 2023
    • UNITED MICROELECTRONICS CORP.
    • BO TAO
    • H01 - BASIC ELECTRIC ELEMENTS