TREA

Jian-Yang He

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  • Tainan City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Metal-bump sidewall protection
    • Patent number 12,272,663
    • Issue date Apr 8, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Jung-Hua Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Metal-bump sidewall protection
    • Patent number 11,476,219
    • Issue date Oct 18, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Jung-Hua Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Metal-bump sidewall protection
    • Patent number 10,784,222
    • Issue date Sep 22, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Jung-Hua Chang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Metal-Bump Sidewall Protection
    • Publication number 20220367397
    • Publication date Nov 17, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jung-Hua Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECTING STRUCTURE, PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
    • Publication number 20220336400
    • Publication date Oct 20, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tsung-Fu Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Metal-Bump Sidewall Protection
    • Publication number 20210005564
    • Publication date Jan 7, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Jung-Hua Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Metal-Bump Sidewall Protection
    • Publication number 20200135677
    • Publication date Apr 30, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jung-Hua Chang
    • H01 - BASIC ELECTRIC ELEMENTS