Jian Zuo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Split RDL connection between die and UBM
- Patent number 12,107,058
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow fiber membrane
- Patent number 10,967,331
- Issue date Apr 6, 2021
- National University of Singapore
- Jian Zuo
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL under bump for elect...
- Patent number 9,142,522
- Issue date Sep 22, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Channels in Encapsulant...
- Publication number 20240395647
- Publication date Nov 28, 2024
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates
- Publication number 20240096807
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Hybrid Substrate with Un...
- Publication number 20240071885
- Publication date Feb 29, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Split RDL Connection Between Die and UBM
- Publication number 20230056780
- Publication date Feb 23, 2023
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A HOLLOW FIBER MEMBRANE
- Publication number 20190247802
- Publication date Aug 15, 2019
- Jian ZUO
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20150091165
- Publication date Apr 2, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Under Bump for Elect...
- Publication number 20130134580
- Publication date May 30, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Split RDL connection between die and UBM

Hollow fiber membrane

Semiconductor device and method of forming patterned repassivation...

Semiconductor device and method of forming RDL under bump for elect...

Semiconductor device and method of forming patterned repassivation...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Channels in Encapsulant...

Semiconductor Device and Method of Stacking Hybrid Substrates

Semiconductor Device and Method of Forming Hybrid Substrate with Un...

Split RDL Connection Between Die and UBM

A HOLLOW FIBER MEMBRANE

Semiconductor Device and Method of Forming Patterned Repassivation...

Semiconductor Device and Method of Forming Patterned Repassivation...

Semiconductor Device and Method of Forming RDL Under Bump for Elect...