Jiang hua Java Zhu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method of reducing mechanical stress on a semiconductor die during...
- Patent number 7,435,624
- Issue date Oct 14, 2008
- SanDisk Corporation
- Chin-Tien Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Molded SiP package with reinforced solder columns
- Publication number 20070252254
- Publication date Nov 1, 2007
- Chin-Tien Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of reducing mechanical stress on a semiconductor die during...
- Publication number 20070254407
- Publication date Nov 1, 2007
- Chin-Tien Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...