Jiang Lushan

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
MEMS capping method
- Patent number 9,731,960
- Issue date Aug 15, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Lushan Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor die and die cutting method
- Patent number 9,613,865
- Issue date Apr 4, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jyishyang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS capping method
- Patent number 9,290,378
- Issue date Mar 22, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Lushan Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE AND DIE CUTTING METHOD
- Publication number 20160204071
- Publication date Jul 14, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jyishyang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS CAPPING METHOD
- Publication number 20160152467
- Publication date Jun 2, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- LUSHAN JIANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CAPPING METHOD
- Publication number 20150298968
- Publication date Oct 22, 2015
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jiang Lushan
- B81 - MICRO-STRUCTURAL TECHNOLOGY