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Jiang Yuan Zhang
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SuZhou City, CN
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last 30 patents
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Patent Grant
Ultra-small chip package and method for manufacturing the same
Patent number
8,704,344
Issue date
Apr 22, 2014
Diodes Incorporated
Hongtao Gao
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
ULTRA-SMALL CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20130147029
Publication date
Jun 13, 2013
DIODES INCORPORATED
Hongtao Gao
H01 - BASIC ELECTRIC ELEMENTS