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Jiangjun WU

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  • Shanghai, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Liquid-cooling plate for CPU
    • Patent number 12,089,367
    • Issue date Sep 10, 2024
    • INVENTEC (PUDONG) TECHNOLOGY CORPORATION
    • Jiangjun Wu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LIQUID-COOLING PLATE FOR CPU
    • Publication number 20230292461
    • Publication date Sep 14, 2023
    • INVENTEC (PUDONG) TECHNOLOGY CORPORATION
    • Jiangjun WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIQUID-COOLING HEAT SINK
    • Publication number 20220408589
    • Publication date Dec 22, 2022
    • INVENTEC (PUDONG) TECHNOLOGY CORPORATION
    • Yidong JI
    • F28 - HEAT EXCHANGE IN GENERAL